FOPLP (FanOut Panel Level Package)

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FOPLP (FanOut Panel Level Package)

Transducer Technology

Introduction

FOPLP technology is a panel fan-out packaging technology, which can replace part of the high-precision PCB and wafer level packaging, and has a better chance to become a fully integrated packaging technology in the future. It is a stepping stone technology for Tianma to take advantage of the panel production line to enter the field of chip and packaging.

Advantage

Excellent Electrical Performance
Thin & light
Warpage Resistance
Low Cost

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